A French company is seeking an industrial company/research centre for developing a new performing display technology under a Eurostars project
A French company, expert in LED (light-emitting diode) display technologies, prepares a Eurostars project as coordinator. The project aims at developing and manufacturing new innovative display technologies, more performing while being mass-manufacturable at low cost. An industrial partner or a research centre, expert in component pick & place and mass transfer of microLed to the display is sought to build a research cooperation agreement.
The partner sought for the R&D collaborative project can be an industrial company or a research centre. It should have expertise in component pick & place and mass transfer of microLeds (with a small size typically 30µmx30µm). Consequently, its role would be to provide the appropriate machine or solution to realize the pick & place, plus the mass transfer of microleds. This cooperation sought is a research cooperation or consortium agreement in order to create an innovative 3D LED display.
The French SME is specialised in the development and manufacturing of an innovative 3D LED display technology, since 2011. This technology allows highly efficient, ultra-bright, and high-resolution displays for a wide range of applications : smartphone, laptop, TV… and displays of tomorrow for virtual reality and augmented reality. The company is looking for collaboration to develop new lighting display technologies, offering greater battery life, outdoors readability, improved image quality and high resolution, while being mass-manufacturable at low cost compared to current LED pixelized products. The company has designed the lighting system in such a way that any microelectronics foundry is able to manufacture it. The project will support the scale-up of the lighting system of the display to larger silicon slices, accelerating the manufacturing process. This technology is able to introduce a revolution in the display technologies. Sought competences for the project : component pick & place and mass transfer. To perform an innovative display, the aim is to transfer small microLed pixel (30µx30µm) on a glass backplane. A transfer head or ‘stamp' goes back and forth between a donor and receiver wafer and carries thousands of chips that are transferred simultaneously with high accuracy. Picking up and accurately positioning the chips is only the first step: reliable electrical connection with the backplane must be ensured, either by the transfer tool, an external tool e.g. a heat plate to melt an eutectic or combination of both. The company hold 128 patents to ensure a Freedom to operate. Deadline for EOI: 30 May 2019 Deadline for Call: 12 September 2019 Project duration: 104 weeks Cooperation would be ruled by a research cooperation/consortium agreement.
Advantages and innovations
Advantages of the innovation is that for manufacturing a display, the company can get rid off TFT (Thin Film Transistor) which actually is an Asian industrial monopole. With its approach, the company is able to manufacture a display with its standard microled GaN (Gallium-Nitride) process on silicon coupled with standard silicon foundry which is a cornerstone for a low cost approach. The company is currently controlling microled supply chain with industrial partners from plasma dicing on silicon wafers. The last missing link is pick & place techniques for the whole display supply chain.
Proposal under development
Intellectual Property Rights (IPR)
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