Partnering opportunity

Innovative Sapphire wafer scribing/dicing technology and optical engine offered

Summary

A Lithuanian SME, specializing in hard material laser processing tools and technology development, is offering their developed Sapphire wafer scribing/dicing technology and optical engine for semiconductor device manufacturers. The company will consider possible commercial agreements with technical assistance, manufacturing agreements with manufacturers as well as joint venture or a research cooperation agreement with research institutions.

Partner sought

The partners that could take advantage of commercial agreements with technical assistance, financial, license and manufacturing agreements should be Sapphire employing semiconductor or electronics devices manufacturers or integrators that require innovative solutions for scribing and dicing of these semiconductor materials. In the case of commercial agreement this technology could be sold either as a service to manufacturer, where main services would be provided from existing location. On the other hand, company is open for suggestion to start manufacturing agreement, should there be a requirement for more than one machine to be produced. Such cooperations might also be considered under the joint venture agreement, where company would provide hardware and partner organisation would take lead of managing its application and sourcing work for it. The partners that would be interested in joint venture and research cooperation agreements should be private companies in the field of semiconductor industry and electronics. Working with a research institution partner, they would be able to run practical testing or provide engineering solutions.

Description

Lithuanian advanced technology company which provides solutions for laser micromachining was established in 2012 and is based in Vilnius - home to more than 20 companies working in the field of photonics. Their team consists entirely of physicists busy with research and development of the technological processes used in our products. The company is closely co-operating with globally known old-timers Light Conversion and Workshop of Photonics. Besides that we are actively participating in preparing new talents for this field. Addressing some current problems facing the hard materials dicing, shuch as slow processing velocity, wide street necessity, large debris and chipping of the process, material overheating issues and high running costs. They are offering a state of the art optical engine for Sapphire substrates or/and wafer scribing, dicing and free shape cut. The technology offered is a state of the art optical engine for Sapphire substrates or/and wafer scribing, dicing and free shape cut designed to suit the needs of the semiconductor device industry (such as LED) or electronics devices industry (sapphire windows, phone touch panel, etc.) that uses these materials. This technology allows fast single or multiple pass up to 0,5 mm thick Sapphire substrate or wafer scribing and dicing with high-quality right angle cut profiles, allowing for easy breaking with no peeling or chipping of the material. The optical engines are compact (~400 x 410 x 700 mm) and with a small footprint. Single, double or multiple beam focus as well as beam focus depth inside the wafer is adjustable. Beam power, pulse duration and repetition adjustments are possible. Additional functions can be added for engines under request from the partners. Company is looking for a partnership opportunities for their technology. It is envisaged that in the case of commercial agreement with technical asssistance this technology could be sold either as a service to manufacturer, where main services can be provided from existing location. While they are focused on finding partners for joint venture agreements, where they would be a supplier of the technology and the partner would undertake the significant further practical research part, company are also looking for joint venture and manufacturing agreements. Manufacturing agreement would see the company prividing technology application services in their location, where joined venture agreement is aimed at expanding their working field and delivering technology through active partnerships within different regions. Company is open for offers to build additional structures in different locations to suit the market needs and help partners to develop partnership. Company is also open for a commercial agreement with technical support offers, where their technology would be purchased by the buyer for their use. Company would be providing full technical assistance and maitenance support as well as consultancy, of the best method of application. While the technology is considered to be fully developed, the SME is keen to work on its further development and wider application under the research cooperation agreement. Working with a research institution partner, they would be able to run practical testing or provide engineering solutions.

Advantages and innovations

This technology is meant for solving problems faced in current hard material dicing technologies: - Processing speed of this technology is 300 mm/sec and above; - This technology requires less energy and material consumption to achieve desired results; - This technology provides high-quality right angle cuts allowing for easy breaking of the wafers without chipping or peeling of the material. This technology solves problems like slow processing velocity, wide street necessity, large debris and chipping of the process, material overheating issues and high running costs that are problems currently faced by using other technologies.

Development stage

Available for demonstration

Intellectual Property Rights (IPR)

Patent(s) applied for but not yet granted


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