Partnering opportunity

Innovative fragile crystalline material wafer scribing/dicing technology and optical engine offered

Summary

A Lithuanian SME, specializing in hard material laser processing technology development, is offering the developed fragile crystalline material (quartz, lithium niobate, etc.) water scribing/dicing technology and optical engine for optical and crystalline material and their products manufacturers. The company is looking for partners working under commercial agreement with technical support or a joint venture agreement.

Partner sought

The partners that could take advantage of commercial agreements with technical assistance should be optical and crystalline material and their products manufacturers or integrators that require innovative solutions for scribing and dicing of these materials. The partners that would be interested in joint venture and research cooperation agreements should be private companies in the field of semiconductor, optical materials industry and electronics.

Description

Lithuanian advanced technology company which provides solutions for laser micromachining was established in 2012. The company has been closely co-operating with globally known companies working in the light conversion and workshop of photonics field as well as actively participating in preparation of new talents for this field. The tool offered by the company is a state of the art optical engine for fragile crystalline material wafer scribing, designed to suit the needs of the optical and crystalline material and their products manufacturers or electronics devices industry that uses these materials. This technology allows fast single or multiple pass up to 0,5 mm thick substrate or wafer scribing and dicing with high-quality right angle cut profiles, allowing for easy breaking with no peeling or chipping of the material. The optical engines are compact (~400 x 410 x 700 mm) and with a small footprint. Single, double or multiple beam focus as well as beam focus depth inside the wafer is adjustable. Beam power, pulse duration and repetition adjustments are possible. Additional functions can be added for engines under request from the partners. Company is looking for a partnership opportunities for their technology. It is envisaged that in the case of commercial agreement with technical assistance this technology could be sold either as a service to manufacturer, where main services can be provided from existing location. The joint venture agreement is aimed at expanding their working field and delivering technology through active partnerships within different regions. Company is open for offers to build additional structures in different locations to suit the market needs and help partners to develop partnership.

Advantages and innovations

This technology is meant for solving problems faced in current hard and fragile material dicing technologies: - Processing speed of this technology is 300 mm/sec and above; - This technology requires less energy and material consumption to achieve desired results; - This technology provides high-quality right angle cuts allowing for easy breaking of the wafers without chipping or peeling of the material. This technology solves problems like slow processing velocity, wide street necessity, large debris and chipping of the process, material overheating issues and high running costs that are problems currently faced by using other technologies.

Development stage

Available for demonstration

Intellectual Property Rights (IPR)

Patent(s) applied for but not yet granted


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